<?xml version="1.0" encoding="utf-8" standalone="yes"?><rss version="2.0" xmlns:atom="http://www.w3.org/2005/Atom"><channel><title>AI数据中心 on 没用知识库</title><link>https://blog.alansun.host/tags/ai%E6%95%B0%E6%8D%AE%E4%B8%AD%E5%BF%83/</link><description>Recent content in AI数据中心 on 没用知识库</description><generator>Hugo -- gohugo.io</generator><language>zh-cn</language><managingEditor>alansundy@gmail.com (羊羊羊)</managingEditor><webMaster>alansundy@gmail.com (羊羊羊)</webMaster><copyright>© 2026 羊羊羊</copyright><lastBuildDate>Mon, 08 Jun 2026 00:00:00 +0000</lastBuildDate><atom:link href="https://blog.alansun.host/tags/ai%E6%95%B0%E6%8D%AE%E4%B8%AD%E5%BF%83/index.xml" rel="self" type="application/rss+xml"/><item><title>光子产业六层技术栈拆解：从磷化铟衬底到 CPO 光互连</title><link>https://blog.alansun.host/posts/20260608_%E5%85%89%E5%AD%90%E6%8A%80%E6%9C%AF%E6%A0%88%E6%8B%86%E8%A7%A3/</link><pubDate>Mon, 08 Jun 2026 00:00:00 +0000</pubDate><author>alansundy@gmail.com (羊羊羊)</author><guid>https://blog.alansun.host/posts/20260608_%E5%85%89%E5%AD%90%E6%8A%80%E6%9C%AF%E6%A0%88%E6%8B%86%E8%A7%A3/</guid><description>将 AI 数据中心光互连产业拆解为衬底材料、外延设备、代工封装、测试良率、光器件模块与网络部署六层技术栈，厘清各环节的核心壁垒、兑现周期与代表标的。</description><media:content xmlns:media="http://search.yahoo.com/mrss/" url="https://blog.alansun.host/posts/20260608_%E5%85%89%E5%AD%90%E6%8A%80%E6%9C%AF%E6%A0%88%E6%8B%86%E8%A7%A3/featured.jpg"/></item></channel></rss>